Abstract: This paper describes the design, operation, and performance of a small-field, step-and-repeat deep-UV projection exposure system for photoresist evaluation and advanced IC process research. Description of the basic sub-systems is given, including the 10X mirror-based projection optics, focus and dose control systems, and the control system user interface that facilitates photoresist characterization experiments. Imaging and characterization results are presented on promising 193 nm photoresist materials. Finally, future work on new resists and on a newly designed, high NA catadioptric lens (patent pending) for sub-quarter micron imaging are described. !4
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