Photosensitive polyamic acid composition for an interlayer isolation of integrated circuits

摘要

Abstract: Optimization of photosensitive composition, investigation of film formation conditions and improvement negative polyimide photoresist properties is accomplished. Polyimide photoresist is suggested for producing an interlayer dielectric coating in high density interconnected modules and passivation layers due to a good electrical insulation properties, planarization, high thermal and chemical stability.!2