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Characterization of low k CVD deposited interlayer dielectrics for integrated circuits

机译：用于集成电路的低k CVD沉积层间电介质的表征

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by Marnie L. Harker.

机译：玛妮·哈克（Marnie L.

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Harker Marnie L. (Marnie Lynn) 1974-;
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年度 1997
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正文语种 eng
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1. Characterization of low-dielectric-constant SiOC thin films deposited by PECVD for interlayer dielectrics of multilevel interconnection [J] . Kim HJ., Shao Q., Kim YH. Surface & Coatings Technology . 2003,第1a3期

机译：PECVD沉积的用于多层互连的层间电介质的低介电常数SiOC薄膜的特性
2. The electric field dependence of Cu migration induced dielectric failure in interlayer dielectric for integrated circuits [J] . Sang-Soo Hwang, Sung-Yup Jung, Young-Chang Joo Journal of Applied Physics . 2007,第7期

机译：集成电路的层间电介质中Cu迁移引起的介电失效的电场依赖性
3. Superconducting integrated circuit fabrication with low temperature ECR-based PECVD SiO2 dielectric films [J] . Sauvageau J.E., Burroughs C.J., Booi P.A.A., IEEE Transactions on Applied Superconductivity . 1995,第2期

机译：低温基于ECR的PECVD SiO2介电薄膜的超导集成电路制造
4. Characterization of cvd deposited amorphous fluorocarbons for low k interlayer dielectrics [C] . Marnie Harker, Indrajit Banerjee, L. Wong, International symposium on "low and high dielectric constant materials: materials science, processing, and reliability issues" . 1998

机译：低k层间电介质CVD沉积无定形氟碳的表征
5. Study of PECVD films containing flourine and carbon and diamond like carbon films for ultra low dielectric constant interlayer dielectric applications. [D] . Sundaram, Nandini Ganapathy. 2016

机译：用于超低介电常数层间电介质应用的含氟和碳的PECVD膜和类金刚石碳膜的研究。
6. Improving the dielectric properties of an electrowetting-on-dielectric microfluidic device with a low-pressure chemical vapor deposited Si3N4 dielectric layer [O] . Hsien-Hua Shen, Lung-Yuan Chung, Da-Jeng Yao 2015

机译：使用低压化学气相沉积的Si3N4介电层改善介电电润湿微流体器件的介电性能
7. Sol-Gel Deposited Porogen Based Porous Low-k Thin Films for Interlayer Dielectric Application in ULSI Circuits [O] . Mhaisagar Y.S., Mahajan A.M. 2012

机译：用于ULSI电路中的层间介电的溶胶-凝胶沉积的多孔原基多孔低k薄膜

Characterization of low k CVD deposited interlayer dielectrics for integrated circuits

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