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A model for enhanced manufacturability of defect tolerantintegrated circuits

机译:用于提高容错集成电路的可制造性的模型

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Many factors contribute the the cost of manufacturing integratedncircuits. These include the yield of the design IC, the complexity ofnits testing, the packaging cost, etc. and they all must be taken intonaccount when designing a defect tolerant integrated circuit. The authorsnpresent a mathematical model which includes all major factorsncontributing to the cost of manufacturing ICs. This model allows thendetermination of the design which maximizes the expected profit rathernthan maximizing the yield. Numerical examples illustrating the proposednmodel are also presented
机译:许多因素贡献了制造集成电路的成本。这些因素包括设计IC的成品率,引线测试的复杂性,封装成本等,而在设计容错集成电路时,必须将其全部考虑在内。作者提出了一个数学模型,其中包括构成IC成本的所有主要因素。该模型可以确定设计,从而使预期利润最大化而不是使收益最大化。还给出了说明所建议模型的数值示例

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