MULTI-BAND RF AND MM-WAVE DESIGN SOLUTIONS FOR INTEGRATEDRF FUNCTIONS IN LIQUID CRYSTAL POLYMER SOP TECHNOLOGY

摘要

Electronic packaging evolution involves systems,technology and material considerations. We present aliquid crystal polymer (LCP) based multilayer packagingtechnology that is rapidly emerging as an ideal platformfor low cost, multi-band and reconfigurable RF front-endmodule integration. LCP’s very low water absorption(0.04%), low cost and high electrical performance makesit very appealing for RF applications. A Single-Input-Single-Output (SISO) dual-band filter operating at ISM2.4-2.5GHz and UNII 5.15-5.85GHz frequency bands, adual polarization, dual frequency 2x1 antenna operating at14 and 35 GHz, and a WLAN IEEE 802.11a compliantcompact module (volume of 75 x 35 x 0.2 mmmm3) havebeen fabricated on LCP substrate, showing the greatpotential of the System-On-Package approach for 3Dcompact, multi-band and reconfigurable integrated RFand millimeter waves functions and modules.