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Thickness-dependent interface parameters of silicon oxide films grown on plasma nydrogenated silicon

机译:等离子体原硅化硅上生长的氧化硅膜的厚度依赖性界面参数

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In the present paper we discuss the defects at the oxide/Si interface and the structure of silicon oxide films grown on plasma hydrogenated (100) and (111)Si. The effect of oxide thickness ranging from 7 to 40 nm on the interface parameters was examined. Electrically active defects were characterized through C-V and G-V measurements. The dependence of the refractive index on oxide thickness was studied. Information on the oxide structure was inferred through the refractive index evaluated from ellipsometric measurements. From both, the electrical and optical results a characteristic oxide thickness was found, below which the oxide structure is different from SiO_2, most probably SiO_x. It is related to a modified Si surface during the pre-oxidation plasma treatment and its value depends on Si orientation and pre-clean conditions. A characteristic oxide thickness of 13 nm was found for Si hydrogenated without heating and, of 9 nm for Si hydrogenated at 300℃.
机译:在本文中,我们讨论了在氧化物/ Si界面处的缺陷以及在等离子氢化(100)和(111)Si上生长的氧化硅膜的结构。研究了氧化物厚度在7到40 nm之间对界面参数的影响。通过C-V和G-V测量来表征电活性缺陷。研究了折射率对氧化物厚度的依赖性。关于氧化物结构的信息是通过椭偏测量法评估的折射率推断出来的。从电学和光学结果两者中,发现了特征性的氧化物厚度,在该厚度以下,该氧化物结构不同于SiO_2,最可能是SiO_x。它与预氧化等离子体处理过程中的改性硅表面有关,其值取决于硅取向和预清洁条件。对于未经加热氢化的Si,发现特征氧化物厚度为13 nm,对于在300℃氢化的Si,特征氧化物厚度为9 nm。

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