首页> 外文会议>Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on >In situ heating to improve adhesion for parylene-on-parylene deposition
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In situ heating to improve adhesion for parylene-on-parylene deposition

机译:原位加热以提高聚对二甲苯在聚对二甲苯上的沉积力

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摘要

A new technique of using “in-situ heating” to enhance adhesion for parylene-on-parylene deposition is reported in this paper. This method is compared with existing physical or chemical adhesion-enhancing methods and the results show clear advantages of this new technique. The physics is believed to be that the mobility of deposition-involved molecules (including the substrate parylene polymer chains and adsorbed monomers during deposition) is enhanced when deposition temperature rises, especially above the glass transition temperature of the substrate parylene. Each sample is patterned and then soaked in 0.9% saline at 90°C, and the undercut between two parylene layers due to the attack from saline during the soaking test could be observed. The undercut rate is measured to quantify the adhesion strength.
机译:本文报道了一种使用“原位加热”来增强聚对二甲苯在聚对二甲苯上沉积的新技术。将该方法与现有的物理或化学增粘方法进行了比较,结果表明该新技术具有明显的优势。据认为,物理学上是,当沉积温度升高时,尤其是在高于衬底聚对二甲苯的玻璃化转变温度以上时,与沉积有关的分子(包括衬底聚对二甲苯聚合物链和在沉积过程中吸附的单体)的迁移率会提高。对每个样品进行构图,然后在90°C下浸泡在0.9%的盐水中,并且可以观察到在浸泡测试过程中,由于盐水的侵蚀,两个聚对二甲苯层之间的底切。测量底切速率以量化粘合强度。

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