首页> 外文会议>IEEE MTT-S International Microwave Symposium Digest;IMS 2009 >Electrothermal gate and channel breakdown model for prediction of power and efficiency in FET amplifiers
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Electrothermal gate and channel breakdown model for prediction of power and efficiency in FET amplifiers

机译:电热栅极和沟道击穿模型,用于预测FET放大器的功率和效率

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摘要

A model of gate-junction leakage and impact ionization is used to predict catastrophic junction- and avalanche-breakdown mechanisms in a FET. It is shown that low-power DC measurements can be used to characterize breakdown and that the model correctly extrapolates to regions outside the safe-operating-area. When included in a large-signal FET model with dynamic calculation of junction temperature, the output power, power-added efficiency (PAE) and peak PAE of a common-source amplifier are well predicted.
机译:栅结泄漏和碰撞电离的模型用于预测FET中的灾难性结和雪崩击穿机制。结果表明,低功率直流测量可用于表征故障,并且该模型可以正确地推断到安全操作区域之外的区域。当包含在动态计算结温的大信号FET模型中时,可以很好地预测共源放大器的输出功率,功率附加效率(PAE)和峰值PAE。

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