首页> 外文会议>Microscopy of semiconducting materials 1999 >Comparison of the interfacial relaxation between AlN/Al_2O_3 (0001) and AlN/6H-SiC (0001) studied with TEM
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Comparison of the interfacial relaxation between AlN/Al_2O_3 (0001) and AlN/6H-SiC (0001) studied with TEM

机译:TEM研究AlN / Al_2O_3(0001)与AlN / 6H-SiC(0001)界面弛豫的比较

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摘要

We investigate the interfacial relaxation of AlN on Al_2O_3 and on 6H-SiC by TEM.We find a typical dislocation density of 10~9cm~-2 in a subsequently grown GaN layer for both substrates despite a clearly different lattice mismatch.HRTEM images of the AlN/Al_2O_3 interface reveal confined misfit dislocations which relax the mismatch efficiently to a residual strain #epsilon#_r approx approx -0.7
机译:我们通过透射电镜研究了AlN在Al_2O_3和6H-SiC上的界面弛豫,尽管晶格失配明显不同,但在随后生长的GaN层中,两个衬底的典型位错密度为10〜9cm〜-2。 AlN / Al_2O_3界面揭示了有限的失配位错,可有效地将失配松弛至残余应变#epsilon#_r约-0.7

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