首页> 外文会议>Microelectronics technology and devices-SBMicro 2009 >Characterization of Gold-Formaldehyde Baths for Electrochemical Deposition
【24h】

Characterization of Gold-Formaldehyde Baths for Electrochemical Deposition

机译:用于电化学沉积的金甲醛浴的表征

获取原文
获取原文并翻译 | 示例

摘要

Cyanide-based gold baths have been widely used for gold plating; however they are recently avoided due to their toxicity. Non-cyanide baths have been developed to overcome those problems, most of them based on Au(I)-sulfide complex, but they are usually unstable. A stable Au(I)-sulfide containing formaldehyde was developed and its behavior has been investigated. The possible electrochemical reactions were analyzed with the aid of Cyclic Voltammetry (CV). In addition, Rutherford Backscattering Spectrometry (RBS) was used to obtain the deposits composition and thickness.
机译:氰化物基金镀液已被广泛用于镀金。但是由于它们的毒性,最近避免使用它们。已经开发出非氰化物浴来克服这些问题,大多数基于Au(I)-硫化物络合物,但是它们通常是不稳定的。开发了一种稳定的含甲醛的硫化金(I),并对其行为进行了研究。借助于循环伏安法(CV)分析可能的电化学反应。此外,卢瑟福背散射光谱法(RBS)用于获得沉积物的成分和厚度。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号