Short-circuit ruggedness of high-voltage IGBTs

摘要

The IGBT can run into different short-circuit types (SC I, SC II, SC III). Especially in SC II and III, an interaction between the gate drive unit and the IGBT takes place. A self-turn-off mechanism after short-circuit turn on can occur. Parasitic elements in the connection between the IGBT and the gate unit as well as asymmetrical wiring of devices connected in parallel are of effect to the short-circuit capability. In high-voltage IGBTs, filament formation can occur at short-circuit condition. Destructive measurements with its failure patterns and short-circuit protection methods are shown.