首页> 外文会议>Micro Electro Mechanical Systems (MEMS), 2009 IEEE 22nd International Conference on; Sorrento,Italy >Performance of Packaged Piezoelectric Microspeakers Depending on the Material Properties
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Performance of Packaged Piezoelectric Microspeakers Depending on the Material Properties

机译:封装的压电微型扬声器的性能取决于材料特性

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This paper presents the improved piezoelectric microspeakers that implement a packaging structure with AlN film and are made of composite diaphragms of different residual stresses. The output Sound Pressure Level (SPL) is enhanced more than 10 dB with a higher compressively stressed composite diaphragm (having -20 MPa silicon nitride film as a supporting layer) from 100 Hz to 3 kHz. The best microspeaker produces more than 100 dB SPL into open field around 3 kHz (when measured 10 mm away from the speaker that is driven with 20 Vpeak-to-peak sinusoidal signal). A microspeaker with a square electrode pattern produces more uniform frequency response above 4 kHz than that with a circular electrode pattern.
机译:本文介绍了改进的压电微型扬声器,该扬声器实现了AlN薄膜的封装结构,并由具有不同残余应力的复合膜片制成。使用更高的压应力复合膜片(具有-20 MPa的氮化硅膜作为支撑层),从100 Hz到3 kHz,输出声压级(SPL)增强了10 dB以上。最好的微型扬声器在3 kHz左右的空旷场中会产生超过100 dB的声压级(在距扬声器20毫米(以20 V <峰到峰正弦信号驱动)的位置测量)。具有方形电极图案的微型扬声器在4 kHz以上的频率响应比具有圆形电极图案的微型扬声器更均匀的频率响应。

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