2/Pt and TiN/TaON/Pt RRAM devices are fabricated and investigated. C'/> Low-Power Resistive Switching Characteristics in TiN/TaON/SiO<inf>2</inf>/Pt RRAM devices for Neuromorphic Applications
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Low-Power Resistive Switching Characteristics in TiN/TaON/SiO2/Pt RRAM devices for Neuromorphic Applications

机译:锡/陶/ SIO 2 / PT RRAM装置的低功率电阻开关特性,用于神经形态应用

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In this work, the TiN/TaON/SiO2/Pt and TiN/TaON/Pt RRAM devices are fabricated and investigated. Compared with the TiN/TaON/Pt control device, TiN/TaON/SiO2/Pt RRAM devices with inserted SiO2 thin film show larger (x10) resistive window at the set compliance current of 1mA. TiN/TaON/SiO2/Pt RRAM devices show low-power resistive switching characteristic with set power of nearly 28.5μW (5.7V 5μA) and reset power of nearly 5.4μW (5.4V 1μA). Endurance characteristic with low-power resistive switching over 106 is demonstrated. The inserted SiO2 thin film may play the role of current limiting layer to achieve the low-power resistive switching characteristics in TiN/TaON/SiO2/Pt RRAM devices.
机译:在这项工作中,TIN / TAON / SIO 2 / PT和TIN / TAON / PT RRAM器件由制造和研究。与TiN / Taon / Pt控制装置相比,锡/陶/ SIO 2 / PT RRAM设备,带插入SIO 2 薄膜在1mA的设定顺应电流下显示较大的(X10)电阻窗口。锡/陶/ SIO 2 / PT RRAM器件显示低功耗开关特性,设定电源近28.5μW(5.7V5μA),复位功率近5.4μW(5.4V1μA)。低功率电阻切换的耐力特性超过10 6 被证明。插入的SiO. 2 薄膜可以发挥电流限制层的作用,以实现锡/陶/ SiO中的低功率电阻切换特性 2 / PT RRAM设备。

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