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On Optimizing Wafer-Probe Testing for Product Quality Using Die-Yield Prediction

机译：用芯片产量预测优化晶圆探头试验对产品质量的研究

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《International Test Conference》|1991年||共1页
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Singh A.D.; Krishna C.M.; Institute of Electric and Electronic Engineer;
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中图分类自动化技术、计算机技术;
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1. On optimizing VLSI testing for product quality using die-yield prediction [J] . Singh A.D., Krishna C.M. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems . 1993,第5期

机译：关于使用模良率预测优化VLSI测试以提高产品质量的信息
2. Optimized Wafer-Probe and Assembled Package Test Design for Analog Circuits [J] . SOUMENDU BHATTACHARYA, ABHIJIT CHATTERJEE ACM Transactions on Design Automation of Electronic Systems . 2005,第2期

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3. Autonomous supervision and optimization of product quality in a multi-stage manufacturing process based on self-adaptive prediction models [J] . Lughofer Edwin, Zavoianu Alexandru-Ciprian, Pollak Robert, Journal of Process Control . 2019,第期

机译：基于自适应预测模型的多阶段制造过程中产品质量的自主监督与优化
4. On Optimizing Wafer-Probe Testing for Product Quality Using Die-Yield Prediction [C] . Singh A.D., Krishna C.M., Institute of Electric and Electronic Engineer International Test Conference . 1991

机译：用芯片产量预测优化晶圆探头试验对产品质量的研究
5. A hybrid model for optimizing customer preference predictions in product design [D] . Noori Naeini, Amir Ali 2011

机译：用于在产品设计中优化客户偏好预测的混合模型
6. Reward rate optimization in two-alternative decision making: empirical tests of theoretical predictions [O] . Patrick Simen, David Contreras, Cara Buck, -1

机译：奖励率优化两个备选决策：理论预测的实证检验
7. Autonomous supervision and optimization of product quality in a multi-stage manufacturing process based on self-adaptive prediction models [O] . Edwin Lughofer, Alexandru-Ciprian Zavoianu, Robert Pollak, 2019

机译：基于自适应预测模型的多阶段制造过程中的自主监督与优化产品质量

On Optimizing Wafer-Probe Testing for Product Quality Using Die-Yield Prediction

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