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Numerical Simulation of Bonding Spot Welding of Steel and Aluminum Door Cover Parts Considering the Thickness of Hemming Adhesive

机译:考虑擦拭粘合剂厚度的钢和铝门盖件粘接点焊的数值模拟

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In this paper, aiming at the bonding spot welding process for heterogeneous metal plates with different strength and thickness, a finite element simulation model for bonding spot welding was established. By using simufact-welding simulation software, the effects of different thickness of adhesive layers on contact resistance, welding heat and welding residual stress of welding process were revealed. The results show that the contact resistance of bonding spot welding process is increased and the heat production of welding joint is increased due to the existence of adhesive layer. The equivalent residual stress of joint has the same change trend in both radial and axial directions, and the minimum value is obtained when the thickness of adhesive layer is 0.05mm.
机译:本文建立了针对具有不同强度和厚度的非均相金属板的粘合点焊过程,建立了用于粘接点焊的有限元模拟模型。通过使用SIMUFAFF焊接仿真软件,揭示了不同厚度粘合剂层对接触电阻的影响,焊接加热和焊接焊接过程的焊接残余应力。结果表明,由于粘合剂层的存在,粘合点焊接过程的接触电阻增加,焊接接头的热量增加。关节的等效残余应力在径向和轴向方向上具有相同的变化趋势,并且当粘合剂层的厚度为0.05mm时获得的最小值。

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