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Numerical Simulation of Bonding Spot Welding of Steel and Aluminum Door Cover Parts Considering the Thickness of Hemming Adhesive

机译:考虑包边胶厚度的钢铝门盖件点焊的数值模拟

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In this paper, aiming at the bonding spot welding process for heterogeneous metal plates with different strength and thickness, a finite element simulation model for bonding spot welding was established. By using simufact-welding simulation software, the effects of different thickness of adhesive layers on contact resistance, welding heat and welding residual stress of welding process were revealed. The results show that the contact resistance of bonding spot welding process is increased and the heat production of welding joint is increased due to the existence of adhesive layer. The equivalent residual stress of joint has the same change trend in both radial and axial directions, and the minimum value is obtained when the thickness of adhesive layer is 0.05mm.
机译:针对不同强度和厚度的异质金属板的点焊工艺,建立了点焊的有限元仿真模型。通过模拟焊接仿真软件,揭示了不同厚度的胶层对接触电阻,焊接热和焊接过程中焊接残余应力的影响。结果表明,由于存在粘结层,提高了点焊的接触电阻,增加了焊接接头的发热。接头的当量残余应力在径向和轴向都具有相同的变化趋势,当胶粘剂层的厚度为0.05mm时,最小值为最小值。

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