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Replacing Global Wires with an On-Chip Network: A Power Analysis

机译:用片上网络代替全球电线:电源分析

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This paper explores the power implications of replacing global chip wires with an on-chip network. We optimize network links by varying repeater spacing, link pipelining, and voltage scaling, to significantly reduce the energy to send a bit across chip. We develop an analytic model of large chip designs with an on-chip two-dimensional mesh network and estimate the power savings possible in a 70 nm process for two different design points: a circuit-switched ASIC or FPGA design, and a dynamic packet-switched tiled architecture. For circuit-switched networks, achievable power savings are 35-50% for a mesh with 1 mm links. The packet switched designs use multiplexing and signal encoding to reduce the number of link wires required, but the router overhead limits peak wire power savings to around 20% with optimal tile sizes of around 2 mm.
机译:本文探讨了用片上网络替换全局芯片电线的功率影响。通过改变转发器间距,链接流水线和电压缩放,优化网络链路,以显着减少芯片跨越芯片的能量。我们开发了具有片上二维网状网的大型芯片设计的分析模型,并在两个不同的设计点的70 nm过程中估算了功率节省:电路交换ASIC或FPGA设计以及动态数据包 - 切换瓷砖架构。对于电路交换网络,可实现功率节省35-50%,对于具有1毫米的链路。数据包交换设计使用多路复用和信号编码,以减少所需的链路线数,但路由器开销将峰值线功率节省限制在大约2毫米的最佳瓷砖尺寸约为20%。

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