Thermal Modeling of BGA Package Families Using the Thermal Resistance and Impedance Calculator (TRIC)

摘要

This paper presents the thermal modeling of Ball Grid Array (BGA) package families using the Thermal Resistance and Impedance Calculator (TRIC) simulation tool. The intrinsic complexity and the great variability of the BGA families make it necessary the introduction of a calibrated thermal modeling strategy, exploiting some of the Authors experiences. In particular, the adoption of equivalent blocks to model the package structure drastically simplifies the geometry definition and the mesh issues to calculate the thermal data in a short amount of time, still guaranteeing the requested level of accuracy.