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Validating cascading of crossbar circuits with an integrated device-circuit exploration

机译:用集成的设备电路探测验证横杆电路的级联

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We present an integrated approach that combines 3D modeling of nanodevice electrostatics and operations with extensive circuit level validation and evaluation. We simulate crossed nanowire field-effect transistor (xnwFET) structures, extract electrical characteristics, and create behavioral models for circuit level validations. Our experiments show that functional cascaded dynamic circuits can be achieved by optimal selection of device level parameters such as VTH. Furthermore, VTH tuning is achieved through substrate biasing and source and drain junction underlap, which does not pose difficult manufacturability and customization challenges. Circuit level simulations of up to forty cascaded stages show correct propagation of data and adequate noise margins.
机译:我们介绍了一种集成方法,将纳米型静电和操作的3D建模结合了广泛的电路电平验证和评估。我们模拟交叉的纳米线场效应晶体管(XNWFET)结构,提取电气特性,并为电路电平验证创造行为模型。我们的实验表明,通过最佳选择诸如V Th 的设备级参数,可以实现功能级联动态电路。此外,通过基板偏置和源极和漏极结来实现V Th 调谐,这不会造成难度的可制造性和定制挑战。电路电平模拟到四十级级联阶段显示了数据的正确传播和充足的噪声边距。

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