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外文会议>IEEE Symposium on VLSI Circuits
>1-Tbyte/s 1-Gbit DRAM Architecture with Micro-pipelined 16-DRAM Cores,8-ns Cycle Array and 16-Gbit/s 3D Interconnect for High Throughput Computing
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1-Tbyte/s 1-Gbit DRAM Architecture with Micro-pipelined 16-DRAM Cores,8-ns Cycle Array and 16-Gbit/s 3D Interconnect for High Throughput Computing
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机译:1-TBYTE / S 1-GBIT DRAM架构,带有微流水线16-DRAM核,8-NS循环阵列和16-Gbit / s 3D互连,用于高吞吐量计算
A novel DRAM architecture with an ultra-high bandwidth is proposed for high throughput computing. The proposed architecture employs three techniques: I) five-stage pipelined I 6-DRAM cores, 2) an early bar write scheme for an 8-ns cycle array operation, and 3) a 16-Gbit/s I/O circuit on each of 32 through-silicon-via pairs/DRAM core. We conducted a circuit simulation assuming a 45-nm I -Gbit chip and confirmed that the proposed architecture achieved a 1-Tbyte/s bandwidth with 19.5-W power consumption.
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机译:提出了一种具有超高带宽的DRAM架构,用于高吞吐量计算。拟议的架构采用三种技术:i)五阶段流水线I 6-DRAM核心,2)为8-ns循环阵列操作的早期条写方案,以及3)每个16-Gbit / s I / O电路32个穿过硅通过对/ DRAM核心。我们进行了一个45nm i-gbit芯片的电路仿真,并确认所提出的架构实现了具有19.5-W功耗的1-Tyte / s带宽。
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