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Defect-tolerant logic hardening for crossbar-based nanosystems

机译:基于横杆的纳米系统的缺陷耐缺陷逻辑硬化

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Crossbar-based architectures are promising for the future nanoelectronic systems. However, due to the inherent unreliability of nanoscale devices, the implementation of any logic functions relies on aggressive defect-tolerant schemes applied at the post-manufacturing stage. Most of such defect-tolerant approaches explore mapping choices between logic variables/products and crossbar vertical/horizontal wires. In this paper, we develop a new approach, namely fine-grained logic hardening, based on the idea of adding redundancies into a logic function so as to boost the success rate of logic implementation. We propose an analytical framework to evaluate and fine-tune the amount and location of redundancy to be added for a given logic function. Furthermore, we devise a method to optimally harden the logic function so as to maximize the defect tolerance capability. Simulation results show that the proposed logic hardening scheme boosts defect tolerance capability significantly in yield improvement, compared to mapping-only schemes with the same amount of hardware cost.
机译:基于交叉开关体系结构是有希望的未来纳米电子系统。然而,由于纳米级装置的固有的不可靠性,任何逻辑功能的实现依赖于在后制造阶段中施加侵蚀性缺陷容错方案。大多数这样的缺陷容限的方法探索逻辑变量/产品和横杆垂直/水平金属丝之间的映射的选择。在本文中,我们开发了一种新方法,即细粒度逻辑硬化的基础上加入裁员成逻辑功能,从而提高逻辑实现的成功率的想法。我们提出了一个分析框架来评估和微调量和冗余的位置添加一个给定的逻辑功能。此外,我们设计一种方法,以最佳硬化逻辑功能,以便最大化缺陷公差的能力。仿真结果表明,所提出的逻辑硬化方案提升显著缺陷公差能力在提高产量相比,用相同量的硬件成本仅映射的方案。

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