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Novel oxygen showering process (OSP) for extreme damage suppression of sub-20nm high density p-MTJ array without IBE treatment

机译:用于极端损伤的新型氧气淋浴过程(OSP),用于极端损伤的Sub-20nm高密度P-MTJ阵列,没有IBE治疗

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A novel damage recovery scheme using the oxygen showering post-treatment (OSP) is proposed to recover patterning damages and to improve electric and magnetic properties of p-MTJs, and its array yield. By applying our OSP to 25nm p-MTJs cell array, the MR was increased from 99% to 116% and the I was decreased from 41.1uA to 28.7uA. Moreover, electric short fails of MTJs array due to metallic by-products reduced dramatically by the selective oxidation of the damaged layer and its isolation from damage-less area. The OSP process makes the switching efficiency of 25nm patterned MTJs to be improved more than 30% compared with IBE treatment process. The mechanism of this enhancement is that spin directions of damaged area is changed from perpendicular to in-plane and, by this change, the energy barrier of damaged area is reduced. By the OSP treatment, we could develop the robust patterning process for sub-20nm STT-MRAM.
机译:采用氧气淋浴后的新型损伤回收方案(OSP),以恢复图案化损害,并改善P-MTJ的电和磁性,其阵列产量。通过将我们的OSP应用于25nm P-MTJS细胞阵列,MR从99%增加到116%,我从41.1ua减少到28.7ua。此外,由于金属副产物由于受损层的选择性氧化而显着降低,因此由于金属副产物而导致的MTJS阵列的电气短的失效及其与损坏区域的隔离。与IBE处理过程相比,OSP过程使25nm图案化MTJ的开关效率提高了30%以上。这种增强的机理是损坏区域的旋转方向从垂直于平面改变,并且通过这种改变,减小了受损区域的能量屏障。通过OSP治疗,我们可以为Sub-20nm STT-MRAM开发强大的图案化过程。

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