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Confined Epitaxial Lateral Overgrowth (CELO): A novel concept for scalable integration of CMOS-compatible InGaAs-on-insulator MOSFETs on large-area Si substrates

机译:狭窄的外延横向过度生长(Cylo):一种用于在大面积Si基板上的CMOS兼容的Indaas-on绝缘体MOSFET的可扩展集成的新概念

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We report on the first demonstration of the CMOS-compatible integration of high-quality InGaAs on insulator (InGaAs-OI) on Si substrates by a novel concept named Confined Epitaxial Lateral Overgrowth (CELO). This method, based on selective epitaxy, only requires the use of standard large-area silicon substrates and typical CMOS processes. It enables the fabrication of InGaAs-OI starting from both bulk and SOI Si wafers. The InGaAs epitaxial structures are characterized by a very low defectivity, and can fulfill the requirements of both ultra-thin-body and fins-based advanced CMOS nodes. Gate-first self-aligned FinFETs (100-nm-long gate, 50-nm-wide fins and 250-nm-wide plug-contacts) with excellent electrical characteristics comparable to start-of-the-art InGaAs MOSFETs on Si are demonstrated, highlighting that this new concept has significant potential to enable introduction of high-mobility channel materials in high-volume manufacturing of advanced CMOS nodes.
机译:我们通过一个名为Conjined外延横向过度生长(Cylo)的新颖概念来报告高质量IngaAs对高质量IngaAs的CMOS兼容集成的第一展示。该方法基于选择性外延仅需要使用标准大面积硅基板和典型的CMOS工艺。它能够从散装和SOI Si晶片开始制造InGaAs-OI。 InGaAs外延结构的特征在于缺陷非常低,并且可以满足超瘦身和基于鳍的高级CMOS节点的要求。对Si上的栅极 - 首先自对准的FinFET(100-nm-Long栅极,50-nm宽的翅片和250-nm宽的插头触点)具有优异的电气特性,可与Si上的最初的InGaAS MOSFET相当。 ,强调这一新概念具有巨大的潜力,以实现高批量生产的高迁移渠道材料的高批量制造。

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