Ground Discharge Effect to the Sensitive Component in the Charged Board Event Type of Electrostatic Discharge

摘要

Functional specifications have usually higher priority than electrostatic discharge (ESD) tolerances and many components are very sensitive to ESD and especially to fast transient pulses during product assembly and manufacturing. Because of the fast rise time of the transient pulse it is quite challenging to evaluate the effect with the standard test methods. The effect of the transient depends also on the surrounding environment and the grounding path. This paper presents a test method for the charged board event (CBE) and shows the effect on a component when the board is discharged from the ground plane. The CBE is studied with 3-D electromagnetic simulations and measurements on a test board. The results indicate that tests can be performed and it is safe to discharge the printed wiring board from the ground plane.