Ni-based films have been extensively studied owing to their potential application in several fields such as metal coatings, microelectronic devices, magnetic devices, and catalysis. One of the techniques to deposit Ni thin films is supercritical fluid chemical deposition (SFCD) that offers the potential for the capability of high conformal step coverages and high-aspect-ratio features at materials dimensions. This technique includes the dissolution of precursor in supercritical fluids, adsorption of precursor and reducing agent onto the substrate surface, the reaction between adsorbed precursor and a reducing agent to its metal or metal oxide form on the substrate surface, and desorption of hydrogenated ligands from the substrate into the supercritical fluids phase. These process steps typically proceed under supercritical carbon dioxide (scCO_2) solution due to its relatively moderate critical temperature (31.1°C) and pressure (7.38 MPa) that has high molecular density, high diffusivity, low viscosity and zero surface tension.
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