Sensitivity Study of Channel Termination on Vertical Side-Chip Interconnection

摘要

This paper investigates the sensitivity of channel termination on vertical side-chip interconnection (VSCI), an alternative high density and low z-height enabler for 3D packaging technology. In this study, the trends of eye height opening, one of the critical signaling parameters, were analyzed based on transmission channel length, input rise time, receiver device capacitance and termination resistance factors. Simulation results show potential solution space for weak receiver termination to achieve >350mV eye height opening (based on IV supply voltage) at 30Gbps. Key enabling factors and design trade-offs were discussed and summarized in this paper for future design considerations.