#x201C;glassPack#x201D; #x2014; photonic packaging using thin glass foils for electrical-optical circuit boards (EOCB) and sensor modules

摘要

The “glassPack”-concept will be introduced as a new packaging technologies platform for a wide area of opto-electronic applications like optical backplane, electrical-optical circuit boards (EOCB) and sensors. The usage of thin glass foils of some tens of microns thickness as substrate and interconnection material is the crucial point of the concept. First realizations will be presented.