首页> 外文会议>Electronics Systemintegration Technology Conference >Highly-compact fibre-optic package for 30#x2013;300GHz wireless transmitter modules
【24h】

Highly-compact fibre-optic package for 30#x2013;300GHz wireless transmitter modules

机译:高度紧凑的光纤封装30– 300ghz无线发射器模块

获取原文

摘要

In this paper, we present a highly-compact fibre-optic package for 30–300GHz wireless transmitter modules with integrated antenna. The overall module size is only 22x17x8.5mm and comprises fibre-chip coupling, electrical beam forming as well as techniques for low millimetre-wave losses. FEM-simulations show that the operational frequency range of the package is at least within 30–300GHz. Furthermore, the package allows a high flexibility in terms of possible chip dimensions. Using this approach, external mm-wave components like antennas or cables can be avoided thus offering a low-cost small-scale solution. A small-series of the presented package has already been constructed. Results with in-house fabricated photomixers with integrated antenna are further presented.
机译:在本文中,我们提供了一个高度紧凑的光纤封装,用于30– 300GHz无线发射器模块,具有集成天线。 整体模块尺寸仅为22x17x8.5mm,包括光纤芯片耦合,电光束成型以及低毫米波损耗的技术。 FEM模拟表明,包装的操作频率范围至少在30范内– 300GHz。 此外,该包装允许在可能的芯片尺寸方面具有很高的灵活性。 使用这种方法,可以避免像天线或电缆等外部MM波组件,从而提供低成本的小规模解决方案。 已经构建了一系列呈现的包装。 进一步提出了带内部制造的光学器,具有集成天线的内部光学夹。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号