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Electro-Fluid-Structural Interaction Simulation of a Valveless Micropump

机译:Valveless Micropump的电流结构相互作用模拟

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In this paper, the pumping performance of a piezoelectric micropump is simulated with the commercial finite element analysis software COMSOL Multiphysics 3.2a. The micropump, which was developed in our previous work, is composed of a four-layer lightweight piezocomposite actuator, a polydimethylsiloxane (PDMS) pump chamber, and two diffusers. The piezoelectric domain, the structural domain and the fluid domain are coupled in the simulation. The water flow rates are numerically predicted for geometric parameters of the micropump. This study confirms that the micropump is optimally designed to obtain its maximum pumping performance.
机译:本文用商业有限元分析软件COMSOL多发性3.2a模拟了压电微泵的泵送性能。 在我们以前的工作中开发的微型泵由四层轻质压电复合致动器,聚二甲基硅氧烷(PDMS)泵室和两个扩散器组成。 压电域,结构结构域和流体结构域在模拟中耦合。 对微泵的几何参数进行数值预测水流速率。 本研究证实,MicroPump最佳地设计,以获得其最大泵送性能。

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