Shock-Reliability Prediction Models for Harsh-Environment Electronics - (PPT)

机译：用于苛刻环境电子产品的冲击可靠性预测模型 - （PPT）

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摘要

Prediction of solder joint reliability for board level drop under varying drop orientations without assuming symmetry conditions. Achieve computational efficiency by incorporating globallocal and beam-shell modeling methodologies. Assessment of design margins at competing failure locations in the board assembly.

机译：在不同滴导液下降的焊接接头可靠性的预测而不假设对称条件。通过结合Globalcal和Beam-Shell建模方法来实现计算效率。董事会大会上竞争失败地点设计边距的评估。

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《Surface Mount Technology Association/CAVE Harsh Environment Electronics Workshop》|2006年||共14页
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Pradeep Lall; Sameep Gupte; Prakriti Choudhary; Jeff Suhling;
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中图分类 TN-53;
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4. Shock-Reliability Prediction Models for Harsh-Environment Electronics - (PPT) [C] . Pradeep Lall, Sameep Gupte, Prakriti Choudhary, Surface Mount Technology Association/CAVE Harsh Environment Electronics Workshop . 2006

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Shock-Reliability Prediction Models for Harsh-Environment Electronics - (PPT)

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