Producing a multi-chip-module with a BGA package requires highly advanced and highly reliable processes. In order to investigate these processes and compare different technologies and materials, a test product was designed. It was populated with five naked dice with a total of 250 I/Os on a PCB substrate with either flash or thick chemical gold. These dice were contacted using standard thin aluminium and gold wire bonding, or high frequency gold wire bonding. The dice were encapsulated with a plastic overmould. Eutectic solder balls were then placed into solder paste on the reverse side of the PCB substrate and reflowed to form a BGA 352 package. The completed BGA modules were soldered onto a test-board and various climatic tests were performed. The paper will discuss the results for the various combinations of technologies applied and materials used for the BGA multi-chip-modules.
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