A new thermoset microwave material

摘要

Currently, the needs for microwave and RF substrates ore covered by thermoplastics materials based on PTFE and by ceramics. Each solution has its own advantages, but it is not possible for any of them to satisfy all electrical and mechanical requirements. A BriteEuram project, called HITCOM for High Thermoset material, began three years ago to formulate, make and demonstrate, from an industrial point of view, a new thermoset material compatible with epoxy board process, and which will satisfy high frequency electrical performances. After a review of the main characteristics, this paper presents the different choices made in term of polymers, fillers and copper plating to get this new material. The methodology to achieve such goals was also presented. At the end a significant number of samples was manufactured and were used to make the characterisation of this new substrate. Results of electrical measurements around 5 GHz are listed and specially the comparison, for a space application, between a circuit made on the existing commercial material and the same based on this new material.