Laminate based multi chip modules for direct chip attachment

摘要

Latest component packaging technologies invoke highest routing density at improved electrical and thermo-mechanical performance. Laminate based multi chip modules (MCM-L) for direct chip attachment are capable to meet the objectives at lower cost than ceramic. In this paper manufacturing techniques for MCM-L are presented. They combine microvia printed circuit board skills with advanced printed circuit board materials and laser hole generation techniques, thus opening a great variety of substrate constructions. A solder bumping completes the processing of the substrate and leaves it with an adequate interface for direct chip attach. Capabilities and limitations of MCM-L and a comparison of competing techniques enlighten the potential of this technology.