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Study on Size Error Compensation of Connecting Bracket Based on Fused Deposition Modeling

机译:基于融合沉积建模的连接支架尺寸误差补偿研究

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In the integrated additive manufacturing of electronic products,the connecting bracket is a typical fixed structure for embedding electronic components such as PCBs,sensors,batteries,etc.The dimensional accuracy of column spacing affects the stability of embedded components directly.In this paper,aiming at the printing error of connecting bracket column spacing during the Fused Deposition Modeling(FDM),the printing error compensation is studied via the single factor experiments.The impact of design size on printing error is analyzed,and the printing error compensation model is established.Based on the FDM printing process of the connecting bracket,the main influencing factors of the printing error are analyzed.The results show that the column spacing printing error is the result of the combination of the dimension error of column printing,the dimension error of base printing and the motion error of the machine.Finally,based on the error compensation model,the compensated connection bracket is printed and the PCBs embedding verification is performed.The PCB can be embedded steadily,which indicates that the established model has higher precision.
机译:在电子产品的综合添加剂制造中,连接支架是一种典型的固定结构,用于嵌入诸如PCB,传感器,电池等的电子元件。柱间距的尺寸精度直接影响嵌入式组件的稳定性。本文,旨在影响嵌入式部件的稳定性。本文在融合沉积建模(FDM)期间连接支架列间距的打印误差时,通过单因素实验研究打印误差补偿。分析了设计大小对打印误差的影响,建立了打印误差补偿模型。根据连接支架的FDM打印过程,分析了打印误差的主要影响因素。结果表明,柱间距打印误差是柱打印尺寸误差的组合,基部的尺寸误差打印和机器的运动错误。最后,基于误差补偿模型,补偿连接胸罩打印CKET并执行PCB嵌入验证。PCB可以稳定地嵌入,这表明建立的模型具有更高的精度。

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