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Combined influence of pin-hole interference and additional hole on the stress intensity factor for a pin loaded finite plate

机译:销孔干扰的综合影响和额外孔对销加载有限板的应力强度因子

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This paper presents the results of Stress Intensity Factors (SIFs) for a crack emanating from a finite width plate with pin loaded cracked hole, through a 2-D plane stress Finite Element analysis using ANSYS. The effect of pin-hole interference and additional stress relieving holes in the plate is investigated. Initial studies were performed on the pin-loaded plate with various crack sizes at the center of the plate, with different interference levels, typical of industrial components. Later, parametric studies were conducted by inserting an additional hole of different diameters placed at a distance from the central cracked hole that acts as stress reliever. The synergistic effect of interference and additional hole in reducing the SIF has been analyzed and the most beneficial interference level, diameter of additional hole and its position has been identified.
机译:本文通过使用ANSYS的二进制线应力有限元分析,介绍了从有限宽度板发出的裂缝的应力强度因子(SIFS)的结果。 研究了引脚孔干扰的影响和板中的附加应力消除孔。 在引脚装载板上进行初始研究,在板的中心处具有各种裂缝尺寸,具有不同的干扰水平,典型的工业部件。 后来,通过将放置在距中央裂纹孔的距离处的附加孔插入充当应力释放的距离的附加孔来进行参数研究。 已经分析了减少SIF的干扰和附加孔的协同效应,并且已经确定了最有益的干扰水平,附加孔的直径及其位置。

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