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Sputtered molybdenum as conductive material for high-temperature microhotplates

机译:溅射的钼作为高温微水流液的导电材料

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This paper presents a fabrication process for high-temperature MEMS microhotplates that uses sputtered molybdenum as a conductive material. Molybdenum has a high melting point (2693°C bulk) and is simpler to deposit and pattern in larger series than platinum. Molybdenum is sensitive to oxidation above 300°C, so during fabrication it is protected by PECVD silicon oxide and then covered by LPCVD SiN. The electrical resistivity is linear with the temperature up to 700°C at least. Molybdenum microhotplate has a higher maximum operating temperature than platinum which is demonstrated by the observation of the boiling of barium carbonate (BaCO3) microcrystals at 1360°C. Annealing at 1100°C is effective in extending the operating range. The molybdenum microhotplate performs far better than platinum also in terms of long-term resistance drift.
机译:本文介绍了使用溅射钼作为导电材料的高温MEMS微水流液的制造方法。 钼具有高熔点(2693° c散装),更简单地存放和较大系列的模式比铂金。 钼对300° c的氧化是敏感的,因此在制造过程中,它受到PECVD氧化硅保护,然后被LPCVD SiN覆盖。 电阻率至少是高达700° c的温度线性。 钼微栅极具有比铂更高的最大工作温度,这是通过在1360&#X00b0的碳酸钡(Baco 3-IM>)微晶的沸腾来证明的铂。 在1100&#x00b0时退火在延长工作范围方面有效。 钼微栅极也比长期电阻漂移更好地表现得比铂更好。

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