Fabrication of Microfluidic Chip Using Two Substrates with Different Tg Temperature

摘要

Hot embossing method was used to fabricate microfluidic chips. Bonding tests were done with PMMA(polymethylmethacrylate), COP( cyclo-olefin polymer) 480R and COP1020R. Using two substrates with different glass transition temperature (Tg) can solve the problem of microstructure deformation in chip bonding. Temperature versus deformation curves of these three materials under certain pressing force were obtained. According to these curves, embossing reference temperature (Tr) can be determined for duplicating microstructure with high accuracy. By using two of the above-mentioned materials, successful bonding between COP480R and COP1020R were observed, while PMMA cannot be bonded with COP480R and COP1020R.