首页> 外文会议>International symposium on trends and new applications of thin films;TATF '98 >Phase Change during the Initial of Ni_(30)Fe_(70)(lnvar) Films on MgO(001) by DC-Biased Plasma-Sputter-Deposition
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Phase Change during the Initial of Ni_(30)Fe_(70)(lnvar) Films on MgO(001) by DC-Biased Plasma-Sputter-Deposition

机译:通过DC偏置等离子体 - 溅射沉积在MgO(001)上的Ni_(30)Fe_(70)Fe_(70)(LNVAR)膜的初始变化期间

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Ni100- xFex films were deposited on MgO(001) substrates at 250°C by dc plasma sputtering of the Ni30Fe70 (Invar) target at 2.5kV in pure Ar gas. A dc bias voltage Vs from 0 to -180V was applied to the substrate during deposition. The film thickness was controlled by changing the sputtering time t from 30sec to 5min. The initial growth structure and composition of the films were investigated by XPS and plan-vier-TEM. The resistance R and its temperature coefficient TCR (150K to 300K) were measured as a function of t and of Vs. The Ni 100 - x Fe x films where x ranges from 69 ± 3 to 71 ± 3 weakly dependent on Vs can be prepared. The films are initially grown in a BCC structure with NiFe(001)‖MgO(001) and NiFe[110] ‖ MgO[100] when t is 30sec As t reaches lmin, the FCC phase appears in the films. When t increases beyond 2 min, the films retain mainly the FCC-NiFe structure with NiFe(001) ‖ MgO(001) and NiFe[100] ‖ MgO[100].The films are not electrically continuous unless t reaches 2 min, 1 min, and 30 sec at Vs=0V, -120 V and -180 V, respectively . R decreases with an increase in t and in Vs, while TCR changes consistently with the change of R.
机译:在纯AR气中的2.5kV下,在250℃下,在250℃下,在250℃下在MgO(001)底物上沉积Ni100- Xfex薄膜。在沉积期间将DC偏置电压Vs从0到-180V施加到基板上。通过将溅射时间T从30sec改变为5min来控制膜厚度。通过XPS和Plan-Vier-TEM研究了膜的初始生长结构和组成。电阻R及其温度系数TCR(150k至300​​k)作为T和Vs的函数测量。 Ni 100 - X Fe X薄膜可以准备69±3至71±3折叠Vs的X范围。薄膜最初在具有NiFe(001)‖MGO(001)和NiFe [110]‖MgO[100]当T达到Lmin时[110]‖MgO[100]在薄膜中出现FCC相。当T超过2分钟时,电影主要保留与NiFe(001)‖MgO(001)和NiFe [100] MgO [100]的FCC-NiFe结构。除非T达到2分钟,薄膜没有电连续,1分别为min,30秒,vs = 0v,-120 v和-180 v。 R随着T和VS的增加而降低,而TCR随着R的变化始终变化。

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