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Propagation loss of metal-coated dielectric parallel-plate waveguide in transverse-electric (TE) mode

机译:横向电气(TE)模式中金属涂覆介电平行板波导的传播损失

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Terahertz (THz) waveguide is an essential component for propagating THz waves. However, it is challenging for fabricating THz waveguides owing to their sub-millimeter sized aperture and high-aspect-ratio feature. Thus, three-dimensional (3D) printing technology combined with the metal coating is developed to fabricate metal-coated dielectric THz waveguides. For coating metal film on 3D printed substrate, electroless plating followed by electroplating has commonly been adopted, yet its low film quality and poor step coverage confine application on THz waveguides. Therefore, we proposed to apply supercritical fluid deposition (SCFD), which enables high-quality film onto high-aspect-ratio structures for fabricating THz devices. In the development of metal-coated dielectric waveguides, the required film thickness and suitable material are essential. Thus, we conducted material selection and derived a model for evaluating the required film thickness. However, the previous study concentrated on transverse-magnetic (TM) mode only. Considering high loss in TM_1 mode and incomplete confinement in TM_0 mode, the lowest transverse electric (TE_1) mode is attracted to low-loss propagation. This study investigated the required film thickness by evaluating the propagation loss in the silicon-based parallel-plate waveguides (PPWG) with different length and different coated Au film thicknesses. The model to estimate propagation loss was expressed in TE mode.
机译:Terahertz(THz)波导是用于传播THz波的必要组件。然而,由于它们的亚毫米尺寸的孔径和高纵横比特征来制造THz波导是具有挑战性的。因此,开发了三维(3D)印刷技术与金属涂层结合以制造金属涂覆的电介质THz波导。对于3D印刷基板上的涂覆金属膜,常用电镀,然后采用电镀,但其低薄膜质量和较差的步骤覆盖范围在THz波导上应用。因此,我们提出应用超临界流体沉积(SCFD),其使高质量的膜能够在用于制造THZ器件的高纵横比结构上。在制造金属涂覆的介电波导中,所需的膜厚度和合适的材料是必需的。因此,我们进行了材料选择并导出了一种用于评估所需膜厚度的模型。然而,以前的研究仅集中在横向磁性(TM)模式上。考虑到TM_1模式的高损耗和TM_0模式下的不完全限制,最低电气(TE_1)模式被吸引到低损耗传播。本研究通过评价具有不同长度和不同涂覆的Au膜厚度的硅基平行板波导(PPWG)中的传播损耗来研究所需的膜厚度。估计传播损耗的模型以TE模式表示。

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