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Measurement of carbon concentration in silicon crystal (ⅩⅩⅡ) Restart of the revision of the SEMI Standard

机译:硅晶体中碳浓度的测量(χⅡ)重启半标题修订

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Introduction Carbon concentration in silicon crystal started from 10~(19)/cm~3. In the transistor and IC period, carbon affected the device performance. In the next LSI period, carbon reduced to about 10~(15)/cm~3 and did not affect the device performance. In the 21 th Century, Si power device became popular and it uses the radiation induced CO pair for the lifetime control. Therefore, the strict control and reduction is important and the lowest level of carbon concentration reduced to 10~(13)/cm~3 range. Carbon concentration measurement is done by the infrared absorption using the ASTM standard procedure first established in 1970. JEIDA established the advanced standard and the result was included in the ASTM revision in 1990. JEIDA was revised for the concentration reduction and the revision of ASTM started in 2014 for 10~(15)/cm~3 regime but was interrupted. We have developed the 2nd generation measurement procedure till 2018 down to 10~(13)/cm~3 and proposed the additional revision in 2019. The history of about 10 step activity is summarized in Tab. 1. Now the revision is restarted by the collaboration with the leading researchers and SEMI standard members over the world based on the preliminary draft of revision including 4 subjects solving the problem, reference material, baseline, instrument test, calibration, and polysilicon measurement. In addition, discussion on the following points started, to eliminate ambiguity and to make clear and easier procedures.
机译:简介硅晶体中的碳浓度从10〜(19)/ cm〜3开始。在晶体管和IC期间,碳对设备性能影响。在下一个LSI期间,碳还原为约10〜(15)/ cm〜3,并不影响器件性能。在21世纪,SI电力器件变得流行,它使用辐射诱导的CO配对进行寿命控制。因此,严格的控制和减少是重要的,并且最低水平的碳浓度降至10〜(13)/ cm〜3的范围。碳浓度测量由自1970年首次建立的ASTM标准程序进行红外吸收。Jeida成立了先进的标准,结果包括在1990年的ASTM修订中。Jeida被修订,因为减少了浓度和ASTM的修订版本2014年10〜(15)/ cm〜3制度,但被打断了。我们开发了第二代测量程序,直到2018年至10〜(13)/ cm〜3,并提出了2019年的额外修订。在标签中概述了大约10步活动的历史。 1.现在,通过基于修订的初步修订草稿,在世界上与世界领先的研究人员和半标准成员合作重新启动了修订,包括4个受试者解决问题,参考资料,基线,仪器测试,校准和多晶硅测量。此外,在以下几点开始讨论,消除歧义并进行清晰和更简单的程序。

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