bonding processes; fatigue; finite element analysis; insulated gate bipolar transistors; semiconductor device models; semiconductor device reliability; solders; thermal analysis; thermal expansion; wires (electric); CTE; IGBT; bonding wire failure; coefficient of thermal expansion; conduction loss characteristics; current 40 A; cyclic power environment; global local finite element method; high junction temperature; high temperature gradients; insulated gate bipolar transistor; life prediction; power cycling test; power module; reliability assessment; solder fatigue; solder joints; stress concentration; thermal analysis; thermal stress; thermomechanical stress; wire-chip interface; Bonding; Insulated gate bipolar transistors; Junctions; Reliability; Stress; Temperature measurement; Wires;
机译:用于评估功率器件模块在温度应力方面的可靠性的功率循环测试方法
机译:通过功率循环测试和热循环测试的有限元分析评估半导体功率器件的疲劳寿命
机译:通过SiC TEG芯片在动力循环试验期间用AG烧结加入和Pb,无铅焊接电力电阻和可靠性特性监测电力模块
机译:使用全局-局部有限元方法进行功率循环测试的功率模块的热分析和可靠性评估
机译:在环境和电源循环测试期间进行倒装芯片组装的过程应力分析和可靠性评估。
机译:基于39年的美国宇航局电力数据统计分析对阿曼苏丹国苏丹国全球变暖的评估并测试了NASA功率对气象测量的可靠性
机译:功率循环试验方法,用于在温度应力方面的可靠性评估