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Millimeter-wave sintering of ceramics with applied pressure

机译:施加压力的陶瓷毫米波烧结

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Pressure-free microwave processing of polycrystalline materials has demonstrated rapid, efficient sintering attributed to volumetric heating and microwave-activated mass transport. However, the potential for improved sintering in the nanoparticle regime has often not been realized in part because of the tendency of nanoparticles to form agglomerates that reduce the density of the green compact leading to large pores and excessive grain growth. The application of pressure during sintering, i.e., hot pressing and hot isostatic pressing, has been shown to be an effective sintering method as the stress resulting from an external load can easily exceed the stress caused by surface tension. The application of pressure can result in faster sintering and lower sintering temperature. The current experimental investigations are being carried out in an 83 GHz, 15 kW gyrotron-based materials processing facility with a hydraulic press integrated into the millimeter-wave applicator in order to exert regulated pressure on the samples being heated by the beam. The pressing fixtures are fabricated from refractory ceramic materials with low microwave absorptivity such as alumina and boron nitride. Uniaxial pressures up to 10 MPa have been applied during sintering. Sample temperature is monitored by a two-color pyrometer. The processing environment can be vacuum or special atmosphere. Results of pressure-enhanced sintering of advanced ceramics will be presented showing rapid sintering rates and high final densification. We compare the measured sintering rate with the predictions of a micro-mechanical theory of sintering based on grain-boundary diffusion [1]. The model shows the sintering rate increases with applied load. The ponderomotive microwave effect [2] included in the model also contributes to increasing the sintering rate.
机译:多晶材料的无压力微波加工已经证明,归因于体积加热和微波活化的大规模运输的快速,有效的烧结。然而,在纳米颗粒制度中改善烧结的可能性通常不是部分地实现的,因为纳米颗粒形成聚集体,其倾向于形成导致大孔隙和过量的晶粒生长的聚集体。在烧结过程中的施加,即热压和热等静压期间,已被证明是一种有效的烧结方法,因为由外部负荷产生的应力可以容易地超过由表面张力引起的应力。压力的施加会导致更快的烧结和较低的烧结温度。目前的实验研究是在83 GHz,15kW的陀螺陀螺基材料加工设备中进行,该材料加工设施与集成到毫米波涂敷器中的液压压力,以便对由梁加热的样品施加调节压力。压制夹具由具有低微波吸收率的耐火陶瓷材料制造,例如氧化铝和氮化硼。在烧结过程中,高达10MPa的单轴压力已应用。通过双色高温计监测样品温度。加工环境可以是真空或特殊的气氛。提出了先进陶瓷的压力增强烧结的结果,显示出快速烧结率和高最终致密化。我们将测量的烧结速率与基于晶粒边界扩散的微机械理论的预测进行比较[1]。该模型显示烧结速率随施加的负载增加。该模型中包含的思考微波效应[2]还有助于增加烧结速率。

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