III-V semiconductors; alumina; boron compounds; ceramics; densification; density; grain boundary diffusion; hot pressing; internal stresses; micromechanics; refractories; semiconductor growth; sintering; surface tension; wide band gap semiconductors; Allt; subgt; 2lt; /subgt; Olt; subgt; 3lt; /subgt; BN; agglomerates; alumina; boron nitride; densification; density; frequency 83 GHz; grain-boundary diffusion; gyrotron-based materials processing; heating; hot isostatic pressing; hydraulic press; micromechanical theory; microwave absorptivity; microwave-activated mass transport; millimeter-wave sintering; nanoparticle regime; polycrystalline materials; ponderomotive microwave effect; power 15 kW; pressure-enhanced sintering; pressure-free microwave processing; refractory ceramic materials; stress; surface tension; volumetric heating; Ceramics; Electromagnetic heating; Laboratories; Microwave technology; Pressing; Temperature measurement;
机译:两阶段主烧结曲线应用于氧化物陶瓷两步烧结
机译:用YBF3-MGF2复合烧结辅助工具微观结构,机械性能和烧结多孔Si3N4陶瓷的烧结机理
机译:毫米波加热的激光陶瓷烧结
机译:陶瓷在施加压力下的毫米波烧结
机译:使用纳米粒子烧结助剂和本体成型技术对粉末加工的渐变金属陶瓷复合材料进行无压烧结。
机译:烧结钢上聚合物衍生陶瓷复合涂层的抗氧化性能和组织评价
机译:微/毫米波电介质稀脂矿石/堇青石玻璃陶瓷作为LTCC和直接铸造基板:当前状态和前景
机译:通过无压烧结,超压烧结和烧结/ HIp加工的氮化硅陶瓷的微观结构表征。