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Millimeter-wave sintering of ceramics with applied pressure

机译:陶瓷在施加压力下的毫米波烧结

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Pressure-free microwave processing of polycrystalline materials has demonstrated rapid, efficient sintering attributed to volumetric heating and microwave-activated mass transport. However, the potential for improved sintering in the nanoparticle regime has often not been realized in part because of the tendency of nanoparticles to form agglomerates that reduce the density of the green compact leading to large pores and excessive grain growth. The application of pressure during sintering, i.e., hot pressing and hot isostatic pressing, has been shown to be an effective sintering method as the stress resulting from an external load can easily exceed the stress caused by surface tension. The application of pressure can result in faster sintering and lower sintering temperature. The current experimental investigations are being carried out in an 83 GHz, 15 kW gyrotron-based materials processing facility with a hydraulic press integrated into the millimeter-wave applicator in order to exert regulated pressure on the samples being heated by the beam. The pressing fixtures are fabricated from refractory ceramic materials with low microwave absorptivity such as alumina and boron nitride. Uniaxial pressures up to 10 MPa have been applied during sintering. Sample temperature is monitored by a two-color pyrometer. The processing environment can be vacuum or special atmosphere. Results of pressure-enhanced sintering of advanced ceramics will be presented showing rapid sintering rates and high final densification. We compare the measured sintering rate with the predictions of a micro-mechanical theory of sintering based on grain-boundary diffusion [1]. The model shows the sintering rate increases with applied load. The ponderomotive microwave effect [2] included in the model also contributes to increasing the sintering rate.
机译:多晶材料的无压微波处理已证明可归因于体积加热和微波激活的传质而进行的快速有效烧结。然而,由于纳米粒子倾向于形成附聚物的趋势而降低了生坯的密度,从而导致大的孔和过度的晶粒生长,因此在纳米粒子领域中改善烧结的潜力常常未被实现。烧结期间施加压力,即热压和热等静压,已被证明是一种有效的烧结方法,因为外部载荷引起的应力很容易超过表面张力引起的应力。施加压力可以导致更快的烧结和更低的烧结温度。当前的实验研究是在83 GHz,15 kW的基于回旋管的材料处理设备中进行的,该设备具有将液压机集成到毫米波施加器中的功能,以便对被光束加热的样品施加调节压力。压制夹具由具有低微波吸收率的耐火陶瓷材料制成,例如氧化铝和氮化硼。在烧结过程中施加了高达10 MPa的单轴压力。样品温度由两色高温计监控。处理环境可以是真空或特殊气氛。将展示先进陶瓷的压力增强烧结结果,显示出快速的烧结速率和较高的最终致密化。我们将测得的烧结速率与基于晶界扩散的烧结微机械理论的预测进行了比较[1]。该模型显示烧结速率随施加的载荷而增加。模型中包含的微波作用[2]也有助于提高烧结速度。

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