We investigated the mechanism of Cu_2O nanosphere bonding on metal thin films induced by femtosecond laser pulses. Cu_2O nanospheres mixed with reductant agents were spin-coated on the metal thin films, the single-layered Cu_2O nanospheres were bonded on the surface of the metals. The minimum energy required for single-layered bonding was found to be in order of Au < Cu < Cr < Si, which was consistent with the plasmon absorption intensities between Cu_2O nanospheres and the metal films. In addition, the Cu_2O nanospheres were reduced to Cu without significant deformation of the spheres. These results suggest that plasmon absorption has a dominant effect on the single-layered bonding of Cu nanospheres on metal thin films. The bonding technique of Cu nanospheres on the metals has a possibility of application of Cu wiring.
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