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Application of the atomic layer etching technique for the formation of SiC-based field emitters

机译:原子层蚀刻技术在基于SiC的场发射器形成中的应用

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This paper presents the technology of obtaining graphene films on the surface of SiC using a combination of methods of focused ion beams and plasma-chemical etching in a fluorine containing environment. For the formation of nanoscale structures with lateral dimensions of 280 nm, the method of focused ion beams was used. Nano sized structures were formed on the surface of silicon carbide by an ion beam, which were subsequently placed in the reactor. In the reactor, the structures on silicon carbide were processed in fluoride plasma. The depth of the structures was 900 nm. SF6 was used for atomic layer etching operations. The study of the surface topology at each iteration was carried out using scanning electron microscopy. Electrical characteristics were measured by atomic force microscopy.
机译:本文介绍了使用聚焦离子束和含氟环境中的等离子体化学蚀刻的方法在SiC表面上获得石墨烯薄膜的技术。 为了形成具有280nm的横向尺寸的纳米级结构,使用聚焦离子束的方法。 通过离子束在碳化硅表面上形成纳米大小结构,其随后置于反应器中。 在反应器中,在氟化硅等离子体中处理碳化硅上的结构。 结构的深度为900nm。 SF6用于原子层蚀刻操作。 使用扫描电子显微镜进行每次迭代的表面拓扑的研究。 通过原子力显微镜测量电特性。

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