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Electrochemical migration and corrosion behaviours of SAC305 reinforced by NiO, Fe2O3, TiO2 nanoparticles in NaCl solution

机译:NiO,Fe2O3,TiO2在NaCl溶液中加固SAC305的电化学迁移和腐蚀行为

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Pb-free solders incorporated with nano-sized particles have been identified, as potential Pb-free nanocomposite solders that could provide higher microstructure stability and better mechanical properties than the conventional solders. Nowadays, the miniaturizations of electronic devices increase in their usage have increased the risk of failure due to ion migration and corrosion phenomena. This research investigates the effects the electrochemical migration (ECM) and corrosion behaviour of Sn-3.0Ag-0.5Cu (SAC305) reinforced by NiO, Fe2O3 and TiO2 nanoparticles in 0.1M NaCl solution. The SAC305 solder alloys were doped with different percentages of NiO, Fe2O3 and TiO2 at nominal percentages of 0.01, 0.05 and 0.15 wt% in producing nanocomposite solder paste. Then, the solder paste has flowed in the reflow oven at the temperature of 240°C. After that, the Water Drop Test (WDT) was performed using 0.1 M NaCl solution to investigate the ion migration behaviour and Potentiodyamic Tafel Polarization technique to determine the corrosion behaviour on the solder alloys. In general, the results showed the mean-time-to-failure (MTTF) of SAC305 solder alloy increased when added of the nanoparticles of NiO, Fe2O3 and TiO2. Besides, SAC305-TiO2 has the longest MTTF in 0.1 M NaCl solution followed by SAC305-Fe2O3 and SAC305-NiO nanoparticles. This results is believed due to the presence of nanoparticles as the alloying element in the solder that hinder the process of ECM to suppress the growth of the dendrites accelerating for the short circuit occurs and causes the failure of the IPC-24 test board. The potentiodynamic polarization curve results exhibit the SAC305 with nanoparticles decreased the corrosion rate compared with SAC305 solder alloy only. SAC305 with NiO and TiO2 have slightly lower corrosion rates compared with Fe2O3 nanoparticles. Therefore, SAC305 reinforced by TiO2, Fe2O3 and NiO nanoparticles exhibited excellent ECM and corrosion resistance behaviours in the 0.1 M NaCl solution.
机译:已鉴定与纳米尺寸颗粒的无铅焊料,作为潜在的无铅纳米复合材料焊料,其可以提供比常规焊料更高的微观结构稳定性和更好的机械性能。如今,电子设备的小型化在其使用中增加了由于离子迁移和腐蚀现象引起的失效风险增加。本研究研究了通过NiO,Fe2O3和TiO2纳米颗粒在0.1M NaCl溶液中加固的SN-3.0AG-0.5Cu(SAC305)的电化学迁移(ECM)和腐蚀行为的影响。 SAC305焊料合金在生产纳米复合焊膏中以0.01,0.05和0.15wt%的标称百分比掺杂不同百分比的NiO,Fe 2 O 3和TiO 2。然后,在240℃的温度下,焊膏流动在回流炉中。之后,使用0.1M NaCl溶液进行水滴试验(WDT),以研究离子迁移行为和电位自行自制蛋白质溶液偏振技术,以确定焊料合金上的腐蚀行为。通常,当添加NiO,Fe2O3和TiO 2的纳米颗粒时,结果表明,SAC305焊料合金的平均故障(MTTF)增加。此外,SAC305-TiO2在0.1M NaCl溶液中具有最长的MTTF,然后是SAC305-Fe2O3和SAC305-NiO纳米颗粒。由于纳米颗粒存在作为焊料中的合金元素的存在,该结果被认为是阻碍ECM的过程,以抑制用于短路的枝形枝条的生长,并导致IPC-24测试板的故障。与SAC305焊料合金相比,电位动力学偏振曲线结果表现出纳米颗粒的SAC305降低了腐蚀速率。与Fe2O3纳米颗粒相比,具有NiO和TiO2的SAC305具有略微较低的腐蚀速率。因此,通过TiO 2,Fe 2 O 3和NiO纳米粒子加固的SAC305在0.1M NaCl溶液中表现出优异的ECM和耐腐蚀性。

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