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Effects of particle size of copper on the electrical property and hardness of copper/graphite/carbon fiber/phenolic resin composites

机译:铜粒径对铜/石墨/碳纤维/酚醛树脂复合材料电性能和硬度的影响

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Composites made from phenolic resin are filled with conductive filler mixtures containing copper powders, natural graphite powders and carbon fibers. They are fabricated by compression molding technique. The density, electrical conductivity and hardness of composite are analyzed to determine the influence of copper particle size on the physical, electrical and mechanical properties of composite. It is found that there is a marked dependence of the electrical conductivity and hardness on copper particle size. The hardness decreases with the decreasing of copper particle size. However the electrical conductivity increases with the decreasing of copper particle size. The decreasing of copper particle size from 75 μm to 48 μm promotes a considerable increase in electrical conductivity by about 427%. The increased continuous conductive metal networks could be the main reason for the increasing of electrical conductivity as copper particle size decreases. The results also show that composites containing copper particles of different sizes have the nearly same density.
机译:由酚醛树脂制成的复合材料填充有含铜粉末,天然石墨粉末和碳纤维的导电填充混合物。它们是通过压缩成型技术制造的。分析了复合材料的密度,导电性和硬度,以确定铜粒径对复合材料的物理,电气和力学性能的影响。发现电导率和硬度对铜粒径的显着依赖性。随着铜粒径的降低而降低硬度。然而,随着铜粒径的降低而增加电导率。从75μm至48μm的铜粒径的降低促进了电导率大大增加约427%。随着铜粒径降低,增加的连续导电金属网络可能是导电率增加的主要原因。结果还表明,含有不同尺寸的铜颗粒的复合材料具有几乎相同的密度。

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