DENDRITIC GROWTH CORROSION UNDER LOW-STANDOFF COMPONENTS IN AUTOMOTIVE ELECTRONICS: A FLUX SOLUTION

摘要

With the increased use of low-standoff components (Double-MOSFETs, Power-QFNs...) in automotive electronics, there is the obvious challenge of poor venting of the no-clean solder paste flux volatiles. This wet flux residue can cause dendritic growth and corrosion for demanding electrical reliability requirements involving high bias, humidity, temperature and time. This study will focus on flux technology breakthroughs and test methods to eliminate dendritic growth due to solder paste flux residue for low-standoff components, while at the same time not compromise on the ability to achieve a robust SMT process with good wetting, eliminate HiP/graping.