Preliminary study on topology optimization of microstructure for two-scales transient thermal conduction and transfer

摘要

The present study addresses topology optimization procedure of microstructure for transient thermal transport problem under a certain macroscopic configuration. The responses of microstructure are represented by using a method of homogenization along with applying material interpolation scheme during the optimization process, namely solid isotropic micro-structure with penalization of intermediate densities (SIMP). Thermal compliance at each time step is considered as an objective function together with utilizing adjoint variable method (AVM) to derive a formulation of analytical sensitivity. As a preliminary study, the sensitivity of homogenized coefficients with respect to the design variable is formulated and its accuracy is verified.