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Design of an on-scribe-line 12-bit dual-slope ADC for wafer acceptance test

机译:用于晶圆验收测试的划线12位双斜率ADC的设计

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Advanced technology suffers from more severe local process variation and thus requires measuring sufficient process control monitoring (PCM) devices to provide reliable wafer acceptance test (WAT) results. Adopting a large-scale device array with multiplexers can measure more PCM samples at a probe without increasing the pad count. Integrating a high-resolution and robust analog-to-digital converter (ADC) with the PCM circuits to replace the high-end ATE further reduces the test cost. It also alleviates the parasitic effects and thus accelerates the test and enhance the measurement accuracy. However, the on-wafer ADC design for WAT needs to be placed within the scribe line of the wafer. This work proposes a 12-bit dual-slope ADC that meets all the requirements for the aforementioned WAT scenario. The proposed switched-capacitor implementation makes the ADC robust against PVT variations. A test chip has been designed and fabricated in 0.18um CMOS. The active area of the proposed ADC is only 57 um by 581 um which well fits the narrow scribe line. Measurement results show the DNL and INL values are within +1.04/-0.8 and +1.83/-1.72 LSB, respectively. The ADC totally consumes 4.6 mW when operates at 3.3V and 3.2 kS/s.
机译:先进的技术遭受了更严重的本地过程变化,因此需要测量足够的过程控制监控(PCM)器件以提供可靠的晶片验收测试(WAT)结果。采用具有多路复用器的大型设备阵列可以在探针处测量更多的PCM样本而不增加焊盘计数。将高分辨率和坚固的模数转换器(ADC)集成使用PCM电路来更换高端ATE进一步降低了测试成本。它还减轻了寄生效应,从而加速了测试并提高了测量精度。然而,需要将用于Wat的晶片ADC设计放置在晶片的划线内。这项工作提出了一个12位双斜率ADC,符合上述WAT方案的所有要求。所提出的开关电容器实现使得ADC对PVT变化的鲁棒。测试芯片的设计和制造在0.18um CMOS中。所提出的ADC的有源区仅为57 um,581 um,适合狭窄的划线。测量结果显示DNL和INL值分别在+ 1.04 / -0.8和+ 1.83 / -1.72 LSB内。 ADC在3.3V和3.2 KS / S操作时完全消耗4.6兆瓦。

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